DE3272398D1 - Miniature circuit processing devices and matrix test heads for use therein - Google Patents
Miniature circuit processing devices and matrix test heads for use thereinInfo
- Publication number
- DE3272398D1 DE3272398D1 DE8383900099T DE3272398T DE3272398D1 DE 3272398 D1 DE3272398 D1 DE 3272398D1 DE 8383900099 T DE8383900099 T DE 8383900099T DE 3272398 T DE3272398 T DE 3272398T DE 3272398 D1 DE3272398 D1 DE 3272398D1
- Authority
- DE
- Germany
- Prior art keywords
- processing devices
- miniature circuit
- circuit processing
- test heads
- matrix test
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011159 matrix material Substances 0.000 title 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US06/317,413 US4510445A (en) | 1981-11-02 | 1981-11-02 | Miniature circuit processing devices and matrix test heads for use therein |
PCT/US1982/001544 WO1983001688A1 (en) | 1981-11-02 | 1982-11-01 | Miniature circuit processing devices and matrix test heads for use therein |
Publications (1)
Publication Number | Publication Date |
---|---|
DE3272398D1 true DE3272398D1 (en) | 1986-09-04 |
Family
ID=23233534
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE8383900099T Expired DE3272398D1 (en) | 1981-11-02 | 1982-11-01 | Miniature circuit processing devices and matrix test heads for use therein |
Country Status (6)
Country | Link |
---|---|
US (2) | US4510445A (de) |
EP (1) | EP0093768B1 (de) |
JP (2) | JPS5880847A (de) |
KR (1) | KR860000227B1 (de) |
DE (1) | DE3272398D1 (de) |
WO (1) | WO1983001688A1 (de) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4510445A (en) * | 1981-11-02 | 1985-04-09 | Joseph Kvaternik | Miniature circuit processing devices and matrix test heads for use therein |
JPS58120650U (ja) * | 1982-02-09 | 1983-08-17 | 日本電子材料株式会社 | プロ−ブカ−ド |
JPS60142531A (ja) * | 1983-12-28 | 1985-07-27 | Yokowo Mfg Co Ltd | 回路基板等の検査装置 |
EP0215146B1 (de) * | 1985-09-16 | 1988-08-03 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH | Vorrichtung zum elektronischen Prüfen von Leiterplatten oder dergleichen |
US4727319A (en) * | 1985-12-24 | 1988-02-23 | Hughes Aircraft Company | Apparatus for on-wafer testing of electrical circuits |
US4878018A (en) * | 1986-02-28 | 1989-10-31 | Malloy James T | Electrical testing device |
JPS63274154A (ja) * | 1987-04-29 | 1988-11-11 | インターナシヨナル・ビジネス・マシーンズ・コーポレーシヨン | プローブ・カード装置 |
US4935694A (en) * | 1988-09-20 | 1990-06-19 | Electro Scientific Industries, Inc. | Probe card fixture |
JPH0621849B2 (ja) * | 1989-02-13 | 1994-03-23 | 工業技術院長 | 材料試験機用の導電性圧子 |
US5144228A (en) * | 1991-04-23 | 1992-09-01 | International Business Machines Corporation | Probe interface assembly |
US5210485A (en) * | 1991-07-26 | 1993-05-11 | International Business Machines Corporation | Probe for wafer burn-in test system |
US5304921A (en) * | 1991-08-07 | 1994-04-19 | Hewlett-Packard Company | Enhanced grounding system for short-wire lengthed fixture |
US5175493A (en) * | 1991-10-11 | 1992-12-29 | Interconnect Devices, Inc. | Shielded electrical contact spring probe assembly |
JPH05215773A (ja) * | 1992-02-04 | 1993-08-24 | Nhk Spring Co Ltd | 多点測定用導電性接触子ユニット |
KR100248571B1 (ko) * | 1992-08-31 | 2000-03-15 | 히가시 데쓰로 | 프로우브 장치 |
US5414369A (en) * | 1992-11-09 | 1995-05-09 | Nhk Spring Co., Ltd. | Coil spring-pressed needle contact probe modules with offset needles |
US5493230A (en) * | 1994-02-25 | 1996-02-20 | Everett Charles Technologies, Inc. | Retention of test probes in translator fixtures |
US5546012A (en) * | 1994-04-15 | 1996-08-13 | International Business Machines Corporation | Probe card assembly having a ceramic probe card |
US5625299A (en) * | 1995-02-03 | 1997-04-29 | Uhling; Thomas F. | Multiple lead analog voltage probe with high signal integrity over a wide band width |
US6373268B1 (en) | 1999-05-10 | 2002-04-16 | Intel Corporation | Test handling method and equipment for conjoined integrated circuit dice |
US6331836B1 (en) * | 2000-08-24 | 2001-12-18 | Fast Location.Net, Llc | Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path |
US6512389B1 (en) * | 2000-11-17 | 2003-01-28 | Aql Manufacturing Services, Inc. | Apparatus for use in an electronic component test interface having multiple printed circuit boards |
ATE371196T1 (de) | 2002-03-05 | 2007-09-15 | Rika Denshi America Inc | Vorrichtung für eine schnittstelle zwischen elektronischen gehäusen und testgeräten |
DE102005030551B3 (de) * | 2005-06-22 | 2007-01-04 | JHS Technik Josef Schäfer | Vorrichtung zum Übertragen von elektrischen Signalen zwischen einem Tester und einem Prüfadapter |
JP4859937B2 (ja) * | 2009-01-21 | 2012-01-25 | 第一ビニール株式会社 | 植物支持用の二分割組立て方式のu型支柱及び該u型支柱構成用の連結具 |
DE102010001152A1 (de) * | 2010-01-22 | 2011-07-28 | Robert Bosch GmbH, 70469 | Elektronikvorrichtung und Herstellungsverfahren für eine Elektronikvorrichtung |
US10096958B2 (en) * | 2015-09-24 | 2018-10-09 | Spire Manufacturing Inc. | Interface apparatus for semiconductor testing and method of manufacturing same |
US20170099536A1 (en) * | 2015-10-06 | 2017-04-06 | Sound Solutions International Co., Ltd. | Electroacoustic transducer with flexible coilwire connection |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3185927A (en) * | 1961-01-31 | 1965-05-25 | Kulicke & Soffa Mfg Co | Probe instrument for inspecting semiconductor wafers including means for marking defective zones |
US3345567A (en) * | 1964-02-26 | 1967-10-03 | Kulicke And Soffa Mfg Company | Multipoint probe apparatus for electrically testing multiple surface points within small zones |
US3437929A (en) * | 1965-08-05 | 1969-04-08 | Electroglas Inc | Automatically indexed probe assembly for testing semiconductor wafers and the like |
US3334354A (en) * | 1966-03-17 | 1967-08-01 | Xerox Corp | Dotting ink recorder |
US3600057A (en) * | 1969-04-17 | 1971-08-17 | Raymond J Leffler | Single slide microscopy apparatus |
US3731191A (en) * | 1969-12-22 | 1973-05-01 | Ibm | Micro-miniature probe assembly |
US3768351A (en) * | 1972-05-08 | 1973-10-30 | Gte Automatic Electric Lab Inc | Method and apparatus for forming holes in a material |
JPS5040550U (de) * | 1973-08-04 | 1975-04-24 | ||
US3930809A (en) * | 1973-08-21 | 1976-01-06 | Wentworth Laboratories, Inc. | Assembly fixture for fixed point probe card |
JPS51117877A (en) * | 1975-04-09 | 1976-10-16 | Seiko Epson Corp | Automatic prober |
US4035723A (en) * | 1975-10-16 | 1977-07-12 | Xynetics, Inc. | Probe arm |
DE2632989A1 (de) * | 1976-07-22 | 1978-02-02 | Hoechst Ag | Verfahren zum regenerieren von schwefelsaeure |
US4052793A (en) * | 1976-10-04 | 1977-10-11 | International Business Machines Corporation | Method of obtaining proper probe alignment in a multiple contact environment |
JPS5448486A (en) * | 1977-09-26 | 1979-04-17 | Matsushita Electric Ind Co Ltd | Automatic measuring unit |
JPS5456378A (en) * | 1977-10-14 | 1979-05-07 | Hitachi Ltd | Wafer prober apparatus |
JPS5486962U (de) * | 1977-11-29 | 1979-06-20 | ||
JPS6019145B2 (ja) * | 1978-07-08 | 1985-05-14 | 日本電信電話株式会社 | 試料受け渡し装置 |
US4510445A (en) * | 1981-11-02 | 1985-04-09 | Joseph Kvaternik | Miniature circuit processing devices and matrix test heads for use therein |
-
1981
- 1981-11-02 US US06/317,413 patent/US4510445A/en not_active Expired - Fee Related
-
1982
- 1982-08-10 JP JP57138079A patent/JPS5880847A/ja active Granted
- 1982-11-01 EP EP83900099A patent/EP0093768B1/de not_active Expired
- 1982-11-01 KR KR8204904A patent/KR860000227B1/ko active
- 1982-11-01 US US06/437,951 patent/US4544888A/en not_active Expired - Fee Related
- 1982-11-01 DE DE8383900099T patent/DE3272398D1/de not_active Expired
- 1982-11-01 WO PCT/US1982/001544 patent/WO1983001688A1/en active IP Right Grant
-
1987
- 1987-05-11 JP JP62114373A patent/JPS63107038A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6253943B2 (de) | 1987-11-12 |
JPH055377B2 (de) | 1993-01-22 |
US4544888A (en) | 1985-10-01 |
EP0093768B1 (de) | 1986-07-30 |
JPS5880847A (ja) | 1983-05-16 |
JPS63107038A (ja) | 1988-05-12 |
EP0093768A1 (de) | 1983-11-16 |
EP0093768A4 (de) | 1984-06-13 |
WO1983001688A1 (en) | 1983-05-11 |
KR840002585A (ko) | 1984-07-02 |
US4510445A (en) | 1985-04-09 |
KR860000227B1 (ko) | 1986-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition | ||
8339 | Ceased/non-payment of the annual fee |